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HRS DF4-5P-2C

Categories Industrial Connectors
Packaging Details: P=2mm
Stock: 70
MOQ: 1
Holes Structure: 1x5P
Number of Rows: 1
Model Number: DF4-5P-2C
Description: 2mm 1x5P 5 1 Non-Latching P=2mm Board In, Direct Wire to Board RoHS
Brand Name: DF4-5P-2C
Pitch: 2mm
Number of PINs Per Row: 5
Delivery Time: 4-6 working days
With Locker: Non-Latching
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HRS DF4-5P-2C

Product Specifications

Product Name: DF4-*P-2C

Brand: HIROSE ELECTRIC CO., LTD.

Usage Temperature Range

-30 +85

Storage Temperature Range

-10 +60

Usage Humidity Range

40% 80%

Storage Humidity Range

40% 70%

Compatible Crimp Terminal

DF4-2428PC(F)(05)

Current Rating

AWG24: 3.0A, AWG26: 2.0A, AWG28: 1.0A

Voltage Rating

AC 250V

Performance ItemTest MethodStandardQTAT
Appearance, Structure, FinishVisual, Dimension Measurement InstrumentConforms to Drawing
MarkingVisual InspectionConfirmed
Insulation ResistanceDC 500 V Measurement1000 M or more-
Withstand VoltageApply AC 650 V for 1 minuteNo flashover or insulation breakdown-
Vibration ResistanceFrequency 10-55 Hz, Amplitude 0.75 mm, 3 directions, 10 cycles eachNo breakage, cracks, or loose parts.-
Shock ResistanceAcceleration 490 m/s, Duration 11 ms, Half-sine wave, 3 axes both directions, 3 times eachNo breakage, cracks, or loose parts.-
Damp Heat Resistance (Steady State)Place in +40 2, 90-95% Humidity for 96 hours (Measure after placing at room temperature for 1-2 hours)Insulation Resistance: 500 M or more
No breakage, cracks, or loose parts.
-
Temperature Cycle-55 85, Time 30 30 min, 5 cycles (Transfer time 2-3 min) (Measure after placing at room temperature for 1-2 hours)Insulation Resistance: 1000 M or more
No breakage, cracks, or loose parts.
-
Solder Heat Resistance (Flow Soldering)Solder Temperature 250, Immersion Time 10 secondsNo significant deformation of appearance or looseness of terminals.-
Solder Heat Resistance (Hand Soldering)Soldering Iron Temperature 300, 3 seconds (Do not apply force to terminals)No significant deformation of appearance or looseness of terminals.-

Notes

  • (Note 1) Includes temperature rise during energization.
  • (Note 2) No condensation.
  • (Note 3) Applicable to long-term storage conditions for unused products before board mounting. For temporary storage during transportation after board mounting, the usage humidity range applies.
  • Test methods not specified in the test standards apply JIS C 5402.
  • QT: Confirmation Test, AT: Product Inspection, : Applicable Item
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