Fabrication Rogers 4360 1.524MM ENIG PCB Circuit Board Material

Top Supplier Rogers 4360 1.524MM ENIG PCB Circuit Board Material

Quick detail:

Features and benefits:

RO4000 thermoset resin system

specially formulated to meet 6.15 Dk

• Ease of fabrication / processes

similar to FR-4

• RO4000 material repeatability

• Low loss

• High thermal conductivity

• Lower total PCB cost solution

than competing PTFE products

Low Z-axis CTE / High Tg

• Design fl exibility

• Plated through-hole reliability

• Automated assembly compatible

Environmentally friendly

• Lead free process compatible

Regional fi nished goods inventory

• Short lead times / quick inventory

turns

• Efficient supply chain

Rogers4360G2 information:

RO4360G2 laminates are 6.15 Dk, low loss, glass-reinforced,hydrocarbon ceramic-fi lled thermoset materials that provide the idealbalance of performance and processing ease. RO4360G2 laminates extend Rogers’ portfolio of high performance materials by providing

customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low

Z-axis CTE for design fl exibility and have the same high Tg as all of the RO4000 product line.

RO4360G2 laminates can be paired with RO4400 prepreg and lower-Dk RO4000 laminate in multi-layer designs.

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:
1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.
RO3000
RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:
1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.
RO4000
RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:
1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.
TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:
1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.