Sign In | Join Free | My wneducation.com
wneducation.com
Products
Search by Category
Home > Other Electronic Components >

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: HCMC008
Certification: ISO9001
Place of Origin: China
MOQ: Negotiation
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 5 tons a month
Delivery Time: 20 days
Packaging Details: Wooden boxes
Grade:: Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface:: Plated or unplated
Dimensions:: Based on customer requirements
Plating:: Nickel plating and gold plaing
Shape:: Shims or sheets or fabricated parts
Price: Negotiable
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

    Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging


    Description:

    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:

    1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

    Quality Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging for sale
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0

    Home| Products| Suppliers| Quality Suppliers| Site Map |About Us |Contact Us |Help |关于我们 |联系我们

    Copyright © 2009 - 2020 wneducation.com. All rights reserved.